TSMC and GlobalFoundries Are Building a New U.S. AI Packaging Supply Chain
A $2 Billion Silicon Interposer Agreement Highlights the Growing Importance of Advanced Packaging in AI Semiconductor Manufacturing iAtlas Daily #76 | Semiconductor & Advanced Packaging | October 13, 2026 The Big Story The TSMC GlobalFoundries partnership is establishing a new U.S.-based manufacturing supply chain for silicon interposers, a critical component in advanced AI semiconductor packaging….