How CMP Creates an Ultra-Flat Semiconductor Surface
💻 iAtlas Semiconductor #9 | 📘 Manufacturing → CMP Introduction Chemical Mechanical Planarization (CMP) creates the extremely flat wafer surfaces required to manufacture modern semiconductor devices layer by layer. Semiconductor fabrication repeatedly adds, patterns, etches, and modifies materials on a silicon wafer. Each process can create small height differences across the surface. If these differences…